Nyob rau hauv siab -stakes worlds ntawm semiconductor manufacturing thiab advanced optics, cov npoo ntawm kev ua yuam kev yog tsis muaj -. Txawm hais tias nws yog theem reticle nyob rau hauv lub tshuab EUV lithography lossis lub lens complex rau aerospace imaging, precision iav Cheebtsam yog qhov tseem ceeb. Txawm li cas los xij, iav tsis yog qhov nyuaj rau tshuab; Nws yog nkig, ua rau micro- cracking, thiab rhiab rau thermal shock.
Ntawm UNPARALLELED, peb tau siv sijhawm ntau xyoo los paub txog lub physics ntawm iav. Los ntawm kev sib txuas cov txheej txheem laser qib siab nrog cov tsoos ultra- precision sib tsoo, peb tau muab "fragility" iav rau hauv kev sib tw kom zoo dua rau peb cov neeg siv khoom. Kab lus no tshawb txog yuav ua li cas peb kov yeej kev lag luam nyuaj tshaj plaws kev tsim khoom hurdles.
⚡ Qhov Kev Sib Tw: Zam "Lub Chip"
Tus yeeb ncuab tseem ceeb hauv kev kho qhov muag iav yog "chipping" lossis "ntug 崩" (beng). Ib txwm siv tshuab txiav feem ntau tawm ntawm micro- cov pob txha tawg uas cuam tshuam cov qauv kev ncaj ncees ntawm ib feem. Hauv cov ntawv thov semiconductor, cov micro- tawg tuaj yeem ua rau muaj cov kab mob sib kis lossis kev puas tsuaj loj hauv lub tshuab nqus tsev.
Peb Txoj Kev: Txoj Kev "Cold"
Peb siv cov txheej txheem Picosecond (Ps) Laser Ua Tshuab. Tsis zoo li ib txwm lasers uas yaj cov khoom (tsim lub tshav kub cuam tshuam cheeb tsam), peb Ps lasers ua hauj lwm ntawm ib tug "txias ablation" txoj cai.
Sublimation over Melting: The ultra- luv pulses (10⁻¹² vib nas this) rhuav molecular bonds ncaj qha, tig cov iav khov rau hauv cov ntshav yam tsis muaj cua sov rau ib puag ncig.
Zero Heat Affected Zone (HAZ): Qhov no tshem tawm cov thermal stress thiab micro{0}} tawg.
Qhov tshwm sim: Peb ua tiav ntug chipping ntawm <5µm (thiab feem ntau <2µm), tshem tawm qhov xav tau rau kev tshaj tawm dav dav - ua polishing.
🌡️ Kev Sib Tw: Thermal Stress & Deformation
Cov iav nthuav dav thiab cog lus nrog kev hloov pauv kub. Rau cov iav semiconductor siv hauv lithography lossis wafer tshuaj xyuas, txawm tias qhov sib txawv ntawm micron tsis tuaj yeem lees txais. Cov txheej txheem ua txheej txheem tuaj yeem ua rau muaj kev ntxhov siab sab hauv uas ua rau lub khob ua rau lub sijhawm.
Peb qhov kev daws teeb meem: Zero-Stress Fabrication
Peb tshwj xeeb hauv kev ua Ultra-Low Expansion (ULE) iav thiab High Purity Fused Silica (HPFS).
Kev ntxhov siab-Kev Ua Haujlwm Dawb: Peb cov txheej txheem "Segmented Laser Scanning" thiab "Pulse Energy Gradation" kom ntseeg tau tias lub zog raug faib sib npaug, tiv thaiv kev ntxhov siab hauv zos.
Cov Khoom Paub Txog: Los ntawm Corning ULE® rau Zerodur®, peb nkag siab txog cov thermal coefficients tshwj xeeb ntawm cov ntaub ntawv uas peb txiav.
Kev ruaj ntseg: Peb cov khoom tswj hwm lawv qhov tseeb geometric txawm nyob rau hauv qhov chaw huab cua ntawm semiconductor fabrication nroj tsuag.
🔬 Qhov Kev Sib Tw: Nto Zoo & Sub- Kev puas tsuaj saum npoo
Hauv optics, nto roughness dictates lub teeb kis tau tus mob. Hauv semiconductors, nws hais txog kev huv. Kev sib tsoo tshuab feem ntau tawm "sub-kev puas tsuaj saum npoo"- tawg zais cia hauv qab qhov chaw uas tuaj yeem nthuav tawm tom qab.
Peb Txoj Kev: Hybrid Manufacturing
Peb muab cov neeg kho tshuab sib tsoo nrog Magnetorheological Finishing (MRF) thiab laser polishing.
Laser Smoothing: Rau cov kev siv tshwj xeeb, peb siv cov kev tswj laser melting kom du nto mus rau qhov roughness (Ra) ntawm <0.1µm yam tsis muaj kev sib cuag ntawm lub cev.
MRF Polishing: Rau cov duab aspheric nyuaj, peb siv cov dej sib nqus kom tshem tawm cov khoom ntawm qib atomic, ua tiav qhov roughness tsawg li Ra <7nm.
Kev tshuaj xyuas: Peb tsis yog kwv yees; peb xyuas. Siv lub teeb dawb interferometry thiab 3D nto profilers, peb xyuas kom txhua qhov ua tau raws li ISO 10110 optical qauv nruj tshaj plaws.
🚀 Daim ntawv thov tsav lub neej yav tom ntej
Peb lub peev xwm hauvprecision iav Cheebtsamyog ua kom muaj kev vam meej hauv cov haujlwm tseem ceeb:
Semiconductor Lithography: Tsim cov theem reticle thiab iav uas tiv taus siab - zog EUV hluav taws xob yam tsis muaj warping.
MEMS & Sensors: Tsim cov kaus mom iav thiab cov substrates nrog los ntawm - iav vias (TGVs) uas muaj kev ua haujlwm siab dua - zaus dua silicon.
Kev Kho Mob & Bio-Tech: Machining micro-fluidic channels thiab bio-chips nrog xoom burrs kom ntseeg tau tias kev tshuaj lom neeg muaj tseeb.
Vim li cas koom tes nrog UNPARALLELED?
iav machining tsis yog hais txog kev txiav; nws yog hais txog kev nkag siab txog cov ntaub ntawv tus ntsuj plig.
Tus thawj coj thev naus laus zis: Peb ntiav kev lag luam- coj Ps laser tshuab thiab siab -cov chaw sib tsoo (xws li Satisloh SPM series).
Complex Geometry: Los ntawm sib sib zog nqus reactive ion etching (DRIE) cov qauv mus rau complex 3D freeform optics, peb lis cov duab lwm tus ua tsis tau.
Xaus-rau-Kev Pabcuam Kawg: Los ntawm kev xaiv cov khoom siv raw (Fused Silica, Sapphire, Zerodur) mus rau qhov kawg metrology, peb tswj tag nrho cov txheej txheem.
Tsis txhob cia cov ntaub ntawv txwv txwv koj tus qauv tsim. Cia peb tshuab qhov ua tsis tau.
Hu rau UNPARALLELED hnub no los tham txog koj cov kev xav tau ultra- iav qhov tseeb.